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Tape frame for use - メーカー・企業と製品の一覧

Tape frame for useの製品一覧

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Dicing tape frame

Dicing tape frame

We also support various special-shaped dicing tape frames in different sizes!

We offer a variety of frames for use with dicing saws. Starting with standard sizes from 5 inches to 12 inches, we manufacture various specially shaped frames. We can produce frames in various shapes based on different drawing data, so please feel free to contact us. 【Specifications】 ■ Material: SUS420-J2 (can be made with other materials) ■ Hardness: HRC47 or higher (also available without heat treatment) ■ Surface: Electroless nickel plating (also available without plating) ■ Flatness: 0.3mm or less ■ Surface roughness: Ra0.3μm or less *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

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We provide reliable dicing tape frames essential for semiconductor manufacturing.

We provide reliable dicing tape frames essential for semiconductor manufacturing.

We also accommodate various special-shaped dicing tape frames in different sizes!

Our company manufactures and sells the essential "Dicing Tape Frame" used in the dicing process. It supports precise cutting and transportation of wafers, achieving high reliability and stability, especially during overseas shipments. Our high-quality frames are adopted in a wide range of fields, including semiconductor manufacturing companies, precision glass processing manufacturers, and research and development institutions. In addition to providing new products, we are also focusing on reuse options such as "regrinding" and "replating," contributing to reduced environmental impact and cost optimization. Furthermore, we offer "laser engraving services" for lot numbers and manufacturing information, which also enhances traceability. 【Specifications】 ■Material: SUS420-J2 (can be made from other materials) ■Hardness: HRC47 or higher (non-heat-treated options available) ■Surface: Electroless nickel plating (non-plated options available) ■Flatness: 0.3mm or less ■Surface roughness: Ra0.3μm or less We propose optimal products and services for companies engaged in dicing processing and contract processing, both domestically and internationally. *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
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